UV curable silver chloride compositions for producing silver coatings

ABSTRACT

The present invention discloses an ultraviolet light curable silver chloride composition and method for making such a composition that may be used to produce an silver coating on a substrate. The disclosed composition does not contain any significant amount of volatile organic solvents that do not become incorporated in the active layer after curing.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation-in-part of U.S. application Ser. No.10/363,247 filed Mar. 5, 2003, which is the U.S. national phase of PCTApplication Number PCT/US01/42042, filed Sep. 6, 2001 and published inEnglish under PCT Article 21(2), which further claims the benefit ofU.S. Provisional Application Ser. No. 60/230,488, filed Sep. 6, 2000.Each of these applications is hereby incorporated by reference.

TECHNICAL FIELD

The present invention relates to ultraviolet light (UV) curable silverchloride compositions capable of producing silver coatings.

BACKGROUND OF THE INVENTION

Silver-containing compounds and pure silver are typically applied to asubstrate through coating, plating or layering. An example of suchapplications is the electrode plating of switches on pressure-sensitivemodules and control panels. This process of plating is used oncomponents for appliances such as microwave and conventional ovens. Inthe field of semiconductor fabrication art, silver plating is applied tosilicon and germanium semiconductor wafers as silver metalizations.Further, silver coatings have been applied to polyester, polycarbonate,vinyl, ceramic and glass substrates.

The predominant approach for applying silver to a substrate involvesdepositing a solvent-based silver solution on the substrate, andsubsequently chemically or thermally curing the solution, thusevaporating the solvent. The result of this process is to leave a solidsilver plating on the substrate.

This approach suffers from numerous disadvantages. One important concernis the toxicity of the solvents currently utilized during theconventional process. These solvents require careful handling,specialized disposal facilities and techniques. As a result, the costsassociated with the use of these toxic solvents are exceedingly high.The workers who handle these toxic solvents open themselves up tosubstantial health hazards even with strict adherence to the safetyguidelines concerning handling and disposal. Another disadvantage is thedifficulty of predicting the uniformity and thickness of the resultantsilver plating after the solvent has evaporated. As a result, thequality and performance of the coating varies widely.

Accordingly, there exists a need to provide safe silver coatingcompositions which exhibit improved appearance and durability.Additionally, there is a need to provide a method of applying animproved composition which furthers the goals of safety and improvedperformance.

SUMMARY OF INVENTION

It is an object of the present invention is to provide a silver chloridecomposition and method in which silver can be disposed on a substratewithout requiring a toxic solvent.

It is another object of the invention is to provide a silver chloridecomposition and method in which deposition of the silver layer isaccomplished quickly and efficiently.

It is yet another object of the invention is to provide a silverchloride composition and method in which a silver coating with apredictable and uniform layer thickness is created.

It is still another object of the present invention to provide animproved silver chloride composition that can be applied by spraying,screen printing, dipping, and brushing.

The present invention discloses an ultraviolet light curable silverchloride composition and method for making such a composition that maybe used to produce a silver layer. The disclosed composition does notcontain any significant amount of volatile organic solvents that do notbecome incorporated in the silver layer after curing. Specifically, thesilver chloride composition contains 5 weight percent, based on thetotal weight of the silver chloride composition, or less volatileorganic solvents by weight.

In accordance with one aspect of the invention, an ultraviolet lightcurable silver chloride composition is provided. The silver chloridecomposition comprises a photocurable organic mixture, silver powder,silver chloride powder, and a photoinitiator. The photocurable mixtureof the silver chloride composition comprises an acrylated epoxy oligomerin an amount of about 1 to 25 weight percent, based on the total weightof the silver chloride composition, an isobornyl acrylate monomer in anamount of about 2 to 16 weight percent, based on the total weight of thesilver chloride composition, and optionally, an aliphatic acrylatedoligomer in an amount of about 0.1 to 15 weight percent, based on thetotal weight percent of the silver chloride composition, and a flowpromoting agent in an amount of 0.1 to 6 weight percent, based on thetotal weight of the silver chloride composition. Furthermore, thephotoinitiator is preferably present in an amount of about 1 to 15weight percent, based on the total weight of the silver chloridecomposition, the silver chloride powder is preferably present in anamount of about 30 to 50 weight percent, based on the total weight ofthe silver chloride composition and the silver metal powder ispreferably present in an amount of about 20 to 60 weight percent, basedon the total weight of the silver chloride composition.

In accordance with yet another aspect of the invention, a method isprovided for depositing a silver coating on a substrate. The methodcomprises a first step of applying to the substrate a silver chloridefluid-phase composition (“silver chloride composition”). The silverchloride composition comprises the silver chloride composition disclosedabove.

The method also includes a second step of illuminating the silvercomposition on the substrate with an ultraviolet light to cause thesilver composition to cure into the silver coating.

In accordance with this method, the silver chloride composition can beselectively deposited on the substrate at specific locations wheresilver plating is desired. It need not be applied to the entiresubstrate.

BEST MODE FOR CARRYING OUT THE INVENTION

Silver Chloride Compositions

Reference will now be made in detail to presently preferred compositionsor embodiments and methods of the invention, which constitute the bestmodes of practicing the invention presently known to the inventor.

In accordance with one aspect of the invention, a presently preferredultraviolet light curable silver chloride composition is provided. Thesilver chloride composition comprises a photocurable organic mixture,silver powder, silver chloride powder, and a photoinitiator. In thispreferred embodiment, the photocurable organic mixture includes anacrylated epoxy oligomer. The acrylated epoxy oligomer is preferablypresent in an amount of about 1 to 25 weight percent, based on the totalweight of the silver chloride composition. If the silver chloridecomposition does not contain an aliphatic acrylated oligomer, theacrylated epoxy oligomer is more preferably present in an amount ofabout 10 to 18 weight percent, based on the total weight of the silverchloride composition, and most preferably about 14 weight percent, basedon the total weight of the silver chloride composition. If the silverchloride composition contains an aliphatic acrylated oligomer, theacrylated epoxy oligomer is more preferably present in an amount ofabout 1 to 3 weight percent, based on the total weight of the silverchloride composition, and most preferably about 2 weight percent, basedon the total weight of the silver chloride composition. Suitableacrylated epoxy oligomers include Radcure Ebecryl 3603 (novolac epoxyacrylate diluted 20% with tripropylent glycol diacrylate), commerciallyavailable from Radcure UCB Corp.; Sartomer CN-120 (difunctionalbisphenol based epoxy acrylate) and CN-124 (difunctional bisphenol basedepoxy acrylate), commercially available from Sartomer Corp.; and EchoResin TME 9310 and 9345, commercially available from Echo Resins. Thepreferred acrylated epoxy oligomer is Ebecryl 3603, which is atri-functional acrylated epoxy novolac. Combinations of these materialsmay also be employed herein.

The preferred photocurable organic mixture also optionally includes analiphatic acrylated oligomer. The aliphatic acrylated oligomer, ifpresent, is preferably present in an amount of about 0.1 to 15 weightpercent, based on the total weight of the silver chloride composition.The aliphatic acrylated oligomer is more preferably present in an amountof about 4 to 10 weight percent, based on the total weight of the silverchloride composition, and most preferably about 7 weight percent, basedon the total weight of the silver chloride composition. The aliphaticacrylated oligomer preferably comprises a urethane oligomer. Suitablealiphatic acrylated oligomers include Radcure Ebecryl 244 (aliphaticurethane diacrylate diluted 10% with 1,6-hexanediol diacrylate), Ebecryl264 (aliphatic urethane triacrylate diluted 15% with 1,6-hexanedioldiacrylate), Ebecryl 284 CN-966A80 (aliphatic urethane diacrylateblended with 20% tripropylene glycol diacrylate) urethanes, commerciallyavailable from Radcure UCB Corp. of Smyrna, Ga.; Sartomer CN-961E75(aliphatic urethane diacrylate blended with 25% ethoxylated trimethylolpropane triacylate), CN-961H81 (aliphatic urethane diacrylate blendedwith 19% 2(2-ethoxyethoxy)ethyl acrylate), CN-963A80 (aliphatic urethanediacrylate blended with 20% tripropylene glycol diacrylate), CN-964(aliphatic urethane diacrylate), CN-966A80 (aliphatic urethanediacrylate blended with 20% tripropylene glycol diacrylate), CN-982A75(aliphatic urethane diacrylate blended with 25% tripropylene glycoldiacrylate) and CN-983 (aliphatic urethane diacrylate), commerciallyavailable from Sartomer Corp. of Exton, Pa.; TAB FAIRAD 8010, 8179,8205, 8210, 8216, 8264, M-E-15, UVU-316, commercially available from TABChemicals of Chicago, Ill.; and Echo Resin ALU-303, commerciallyavailable from Echo Resins of Versaille, Mo.; and Genomer 4652,commercially available from Rahn Radiation Curing of Aurora, Ill. Thepreferred aliphatic acrylated oligomers include Ebecryl 264 and Ebecryl284. Ebecryl 264 is an aliphatic urethane triacrylate of 1200 molecularweight supplied as an 85% solution in hexanediol diacrylate. Ebecryl 284is aliphatic urethane diacrylate of 1200 molecular weight diluted 10%with 1,6-hexanediol diacrylate. Combinations of these materials may alsobe employed herein.

The preferred photocurable organic mixture further includes anethylenically unsaturated monomer having Formula I:

wherein R₁ is hydrogen or substituted or unsubstituted alkyl; and R₂ issubstituted or unsubstituted alkyl having more than 4 carbon atoms,substituted or unsubstituted cycloalkyl, substituted or unsubstitutedcycloalkenyl, or substituted or unsubstituted aryl. Preferably R₁ ishydrogen or methyl; and R₂ is isobornyl, phenyl, benzyl,dicyclopentenyl, cyclohexyl, 3,3,5-trimethyl cyclohexyl, dicyclopentenyloxyethyl, and naphthyl. In some variations, the ethylenicallyunsaturated monomer is present in an amount from about 1 to about 20weight percent, base on the total weight of the silver chloridecomposition. The most preferred ethyleneically unsaturated monomers areisobornyl acrylate monomers. The isobornyl acrylate monomers arepreferably present in an amount of about 2 to 16 weight percent, base onthe total weight of the total weight of the silver chloride composition.If the silver chloride composition does not contain an aliphaticacrylated oligomer, the isobornyl acrylate monomer is more preferablypresent in an amount of about 6 to 10 weight percent, based on the totalweight of the silver chloride composition, and most preferably about 8weight percent, based on the total weight of the silver chloridecomposition. If the silver chloride composition contains an aliphaticacrylated oligomer, the isobornyl acrylate monomer is more preferablypresent in an amount of about 2 to 6 weight percent, based on the totalweight of the silver chloride composition, and most preferably about 5weight percent, based on the total weight of the silver chloridecomposition. Suitable isobornyl acrylate monomers include SartomerSR-423 (isobornyl methacrylate) IBOMA and SR-506 (isobornyl acrylate)IBOA; Radcure IBOA (isobornyl acrylate), commercially available fromRadcure Corp.; IBOA and IBOMA, commercially available from CPS Chemical;and Genomer 1121, commercially available from Rahn Radiation Curing. Thepreferred isobornyl acrylate monomers is Radcure IBOA, commerciallyavailable from Radcure Corp. Combinations of these materials may also beemployed herein.

The preferred photocurable organic mixture optionally includes a flowpromoting agent preferably present in an amount of about 0.1 to 6 weightpercent, based on the total weight of the silver chloride composition.The flow promoting agent is more preferably present in an amount ofabout 0.1 to 2 weight percent, based on the total weight of the silverchloride composition, and most preferably about 0.7 weight percent,based on the total weight of the silver chloride composition. Suitableflow promoting agents include Genorad 17, commercially available fromRahn Radiation Curing; and Modaflow, commercially available fromMonsanto Chemical Co., St. Louis, Mo. The preferred flow promoting agentis Modaflow which is an ethyl acrylate and 2-ethylhexyl acrylatecopolymer that improves the flow of the composition. Combinations ofthese materials may also be employed herein.

The silver chloride composition also includes a silver chloride powderpreferably present in an amount of about 30 to 50 weight percent, basedon the total weight of the silver chloride composition. The silverchloride powder is more preferably present in an amount of about 35 to45 weight percent, based on the total weight of the silver chloridecomposition, and most preferably about 40 weight percent, based on thetotal weight of the silver chloride composition. The silver powdercomprises a plurality of particles. In this preferred silver chloridecomposition, the silver powder has a particle size range for theseparticles of about 4 microns to about 18 microns. Preferably, the silverchloride powder particles have a particle size distribution whereinabout 10 percent, based on the total number of the silver chloridepowder particles, have a particle size of less than about 4 microns,about 50 percent of the particles have a particle size of less thanabout 8 microns, and about 90 percent of the particles have a particlesize of less than about 18 microns. The preferred silver chloride powderRDAGCL50 is available from Degussa Corp. of South Plainfield, N.J.

The silver chloride composition also includes a silver powder preferablypresent in an amount of about 20 to 60 weight percent, based on thetotal weight of the silver chloride composition. If the silver chloridecomposition does not contain an aliphatic acrylated oligomer, the silverpowder is more preferably present in an amount of about 25 to 45 weightpercent, based on the total weight of the silver chloride composition,and most preferably about 32 weight percent, based on the total weightof the silver chloride composition. If the silver chloride compositioncontains an aliphatic acrylated oligomer, the silver powder is morepreferably present in an amount of about 30 to 50 weight percent, basedon the total weight of the silver chloride composition, and mostpreferably about 41 weight percent, based on the total weight of thesilver chloride composition. The silver powder comprises a plurality ofparticles. In this preferred silver chloride composition, the silverpowder has a particle size range for these particles of about 5 micronsto about 15 microns. Preferably, the silver powder particles have aparticle size distribution wherein about 10 percent, based on the totalnumber of the silver powder particles, have a particle size of less thanabout 4.7 microns, about 50 percent of the particles have a particlesize of less than about 7.6 microns, and about 90 percent of theparticles have a particle size of less than about 14.9 microns. Thepreferred silver powders are Silver Powder EG-ED and Silver Powder C-EDcommercially available from Degussa Corp. of South Plainfield, N.J.

The silver chloride composition also includes a photoinitiatorpreferably present in an amount of about 1 to 15 weight percent, basedon the total weight of the silver chloride composition. Thephotoinitiator is more preferably present in an amount of about 2 to 7weight percent, based on the total weight of the silver chloridecomposition, and most preferably about 5 weight percent, based on thetotal weight of the silver chloride composition. Suitablephotoinitiators include Irgacure 184 (1-hydroxycyclohexyl phenylketone), Irgacure 907 (2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one), Irgacure 369(2-benzyl-2-N,N-dimethylamino-1-(4-morpholinophenyl)-1-butanone),Irgacure 500 (the combination of 1-hydroxy cyclohexyl phenyl ketone andbenzophenone), Irgacure 651 (2,2-dimethoxy-2-phenyl acetophenone),Irgacure 1700 (the combination ofbis(2,6-dimethoxybenzoyl-2,4-,4-trimethyl pentyl phosphine oxide and2-hydroxy-2-methyl-1-phenyl-propan-1-one), Ciba-Geigy 1700, and DAROCUR1173 (2-hydroxy-2-methyl-lphenyl-propan-1-one) and 4265 (the combinationof 2,4,6 trimethylbenzoyldiphenyl-phosphine oxide and 2-hydroxy2-methyl-1-phenyl-propan-1-one), available commercially from Ciba-GeigyCorp., Tarrytown, N.Y.; CYRACURE UVI-6974 (mixed triaryl sulfoniumhexafluoroantimonate salts) and CYRACURE UVI-6990 (mixed triarylsulfonium hexafluorophosphate salts) available commercially from UnionCarbide Chemicals and Plastics Co. Inc., Danbury, Conn.; and GenocureCQ, Genocure BOK, and Genocure M.F., commercially available from RahnRadiation Curing. The preferred photoinitiator is Irgacure 1700commercially available from Ciba-Geigy of Tarrytown, N.Y. Combinationsof these materials may also be employed herein.

To illustrate, the following example sets forth a presently preferredsilver composition according to this aspect of the invention.

EXAMPLE 1

This example provides a preferred silver chloride composition accordingto the invention. The silver chloride composition was made from thefollowing components: Approximate Component Weight % IBOA 8.4 Irgacure1700 4.6 Ebecryl 3603 13.7 Modaflow 0.7 Silver Chloride 40.3 powder -RDAGCL50 Washed Silver 32.3 powder - EGED Total 100.00

In this example the IBOA and Iragure 1700 are mixed in a pan with apropeller blade mixer for 30 seconds at a speed of 500 to 1000 rpm.Next, the Ebecryl 3603 and the Modaflow are introduced into the pan andmixed for 1 to 2 minutes at a speed of 1000 rpm. In the next step, theEGED silver powder and the silver chloride powder are introduced intothe pan and are mixed for 1 to 2 minutes at a speed of 1000 rpm.Finally, the mixing speed is increased to 10,000 rpm and mixed for anadditional 5 minutes.

For best results, the silver powder is washed prior to addition to themixture. The washing process includes a first step of loading the powderin a sealable container. A mixture consisting of 17 weight percent,based on the total weight of the silver chloride composition, methylethyl ketone and 83 weight percent, based on the total weight of thesilver chloride composition, silver chloride composition is added to thecontainer and the slurry is mixed with a propeller blade for 5 minutesat 500 rpm. The methyl ethyl ketone is poured off and the silver powderis allowed to air dry. During the drying stage the powder isperiodically mixed.

EXAMPLE 2

This example provides a preferred silver chloride composition accordingto the invention. The silver chloride composition was made from thefollowing components: Approximate Component Weight % IBOA 4.7 Irgacure1700 3.9 Ebecryl 264 7.2 Ebecryl 3603 2.4 Modaflow 0.8 Silver Chloride40.0 powder - RDAGCL50 Washed Silver 41.0 powder - EGED Total 100.00

In this example the IBOA and Iragure 1700 are mixed in a pan with apropeller blade mixer for 30 seconds at a speed of 500 to 1000 rpm.Next, the Ebecryl 264, the Ebecryl 3603, and the Modaflow are introducedinto the pan and mixed for 1 to 2 minutes at a speed of 1000 rpm. In thenext step, the EGED silver powder and the silver chloride powder areintroduced into the pan and are mixed for 1 to 2 minutes at a speed of1000 rpm. Finally, the mixing speed is increased to 10,000 rpm and mixedfor an additional 5 minutes.

For best results, the silver powder is washed prior to addition to themixture. The washing process includes a first step of loading the powderin a sealable container. A mixture consisting of 17 weight percentmethyl ethyl ketone and 83 weight percent silver powder composition isadded to the container and the slurry is mixed with a propeller bladefor 5 minutes at 500 rpm. The methyl ethyl ketone is poured off and thesilver powder is allowed to air dry. During the drying stage the powderis periodically mixed.

Method for Depositing an Silver Coating on a Substrate

In accordance with still another aspect of the invention, a method isprovided for depositing a silver coating on a suitable substrate. Themethod comprises a first step of applying a fluid-phase silver chloridecomposition to the substrate.

The preferred silver chloride composition comprises an acrylated epoxyoligomer in an amount of about 1 to 25 weight percent, based on thetotal weight of the silver chloride composition, an aliphatic acrylatedoligomer in an amount of about 0.1 to 15 weight percent, based on thetotal weight of the silver chloride composition, an isobornyl acrylatemonomer in an amount of about 2 to 16 weight percent, based on the totalweight of the silver chloride composition, a photoinitiator in an amountof about 1 to 15 weight percent, based on the total weight of the silverchloride composition, a flow promoting agent in an amount of 0.1 to 6weight percent, based on the total weight of the silver chloridecomposition, silver chloride powder in an amount of about 30 to 50weight percent, based on the total weight of the silver chloridecomposition, and silver metal powder in an amount of about 20 to 60weight percent, based on the total weight of the silver chloridecomposition. The preferred silver chloride compositions for use inaccordance with this method are those described herein, for example,including the compositions described in example 1 and example 2.

The silver chloride composition may be applied to the substrate using anumber of different techniques. The silver chloride composition may beapplied, for example, by direct brush application, or it may be sprayedonto the substrate surface. It also may be applied using a screenprinting technique. In such screen printing technique, a “screen” as theterm is used in the screen printing industry is used to regulate theflow of liquid composition onto the substrate surface. The silvercomposition typically would be applied to the screen as the lattercontacts the substrate. The silver chloride composition flows throughthe silk screen to the substrate, whereupon it adheres to the substrateat the desired film thickness. Screen printing techniques suitable forthis purpose include known techniques. However, the process is adjustedin ways known to persons of ordinary skill in the art to accommodate theviscosity, flowability, and other properties of the liquid-phasecomposition, the substrate and its surface properties, etc. Flexographictechniques, for example, using pinch rollers to contact the silverchloride composition with a rolling substrate, also may be used.

The method includes a second step of illuminating the silver fluid-phasecomposition on the substrate with an ultraviolet light to cause thesilver fluid-phase composition to cure into the silver coating. Thisillumination may be carried out in any number of ways, provided theultraviolet light or radiation impinges upon the silver composition sothat the silver composition is caused to polymerize to form the coating,layer, film, etc., and thereby cures.

Curing preferably takes place by free radical polymerization, which isinitiated by an ultraviolet radiation source. The photoinitiatorpreferably comprises a photoinitiator, as described above.

Various ultraviolet light sources may be used, depending on theapplication. Preferred ultraviolet radiation sources for a number ofapplications include known ultraviolet lighting equipment with energyintensity settings of, for example, 125 watts, 200 watts, and 300 wattsper square inch.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details, representative devices, andillustrative examples shown and described. Accordingly, departures maybe made from such details without departing from the spirit or scope ofthe general inventive concept.

While embodiments of the invention have been illustrated and described,it is not intended that these embodiments illustrate and describe allpossible forms of the invention. Rather, the words used in thespecification are words of description rather than limitation, and it isunderstood that various changes may be made without departing from thespirit and scope of the invention.

1. A photocurable silver chloride composition comprising: a photocurableorganic mixture; a photoinitiator; silver powder; and silver chloridepowder; wherein the photocurable organic mixture comprises: anethylenically unsaturated monomer having Formula I:

wherein R₁ is hydrogen or substituted or unsubstituted alkyl; and R₂ isa substituted or unsubstituted alkyl having more than 4 carbon atoms, asubstituted or unsubstituted cycloalkyl, a substituted or unsubstitutedalkyl cycloalkenyl, or a substituted or unsubstituted aryl.
 2. Thesilver chloride composition of claim 1 wherein R₁ is hydrogen or methyl;and R₂ is isobornyl, phenyl, benzyl, dicyclopentenyl, cyclohexyl,3,3,5-trimethyl cyclohexyl, dicyclopentenyl oxyethyl, and naphthyl. 3.The silver chloride composition of claim 1 wherein the photocurableorganic mixture further comprises an acrylated epoxy oligomer.
 4. Thesilver chloride composition of claim 3 wherein the acrylated epoxyoligomer is selected from the group consisting of: novolac epoxyacrylate diluted 20 weight percent by weight with tripropylene glycoldiacrylate; difunctional bisphenol based epoxy acrylate; and mixturesthereof.
 5. The silver chloride composition of claim 3 wherein theacrylated epoxy oligomer is present in an amount of about 1 to 25 weightpercent, based on the total weight of the silver chloride composition.6. The silver chloride composition of claim 1 wherein the ethylenicallyunsaturated monomer comprises an isobornyl acrylate monomer present inan amount of about 2 to 16 weight percent, based on the total weight ofthe silver chloride composition.
 7. The silver chloride composition ofclaim 1 wherein the silver powder is present in an amount of about 20 to60 weight percent, based on the total weight of the silver chloridecomposition.
 8. The silver chloride composition of claim 1 wherein thesilver chloride powder is present in an amount of about 30 to 50 weightpercent, based on the total weight of the silver chloride composition.9. The silver chloride composition of claim 1 wherein the photoinitiatoris present in an amount of about 1 to 15 weight percent, based on thetotal weight of the silver chloride composition.
 10. The silver chloridecomposition of claim 1 further comprising a flow promoting agent. 11.The silver chloride composition of claim 1 further comprising analiphatic acrylated oligomer.
 12. The silver chloride composition ofclaim 11 wherein the aliphatic acrylated oligomer is an aliphaticacrylated urethane oligomer.
 13. The silver chloride composition ofclaim 12 wherein the aliphatic acrylated urethane oligomer is selectedfrom the group consisting of: a) aliphatic urethane diacrylate diluted10 weight percent by weight with 1,6-hexanediol diacrylate; b) aliphaticurethane triacrylate diluted 15 weight percent by weight with1,6-hexanediol diacrylate); c) aliphatic urethane diacrylate blendedwith 20 weight percent by weight tripropylene glycol diacrylate; d)aliphatic urethane diacrylate blended with 25 weight percent by weightethoxylated trimethylol propane triacrylate; e) aliphatic urethanediacrylate blended with 19 weight percent by weight2(2-ethoxyethoxy)ethyl acrylate; f) aliphatic urethane diacrylateblended with 20 weight percent by weight tripropylene glycol diacrylate;g) aliphatic urethane diacrylate blended with 20 weight percent byweight tripropylene glycol diacrylate; h) aliphatic urethane diacrylateblended with 25 weight percent by weight tripropylene glycol diacrylate;i) aliphatic urethane diacrylate; and j) mixtures thereof.
 14. Thesilver chloride composition of claim 12 wherein the aliphatic acrylatedoligomer is present in an amount of about 0.1 to 15 weight percent,based on the total weight of the silver chloride composition.
 15. Aphotocurable silver chloride composition comprising: a photocurableorganic mixture; a photoinitiator; silver powder; and silver chloridepowder; wherein the photocurable organic mixture comprises: an acrylatedepoxy oligomer; and an ethylenically unsaturated monomer having FormulaI:

wherein R₁ is hydrogen or substituted or unsubstituted alkyl; and R₂ issubstituted or unsubstituted alkyl having more than 4 carbon atoms, asubstituted or unsubstituted cycloalkyl; a substituted or unsubstitutedalkyl cycloalkenyl, or a substituted or unsubstituted aryl.
 16. Thesilver chloride composition of claim 15 wherein R₁ is hydrogen ormethyl; and R₂ is isobornyl, phenyl, benzyl, dicyclopentenyl,cyclohexyl, 3,3,5-trimethyl cyclohexyl, dicyclopentenyl oxyethyl, andnaphthyl.
 17. The silver chloride composition of claim 15 wherein theethylenically unsaturated monomer comprises an isobornyl monomer. 18.The silver chloride composition of claim 17 wherein: the acrylated epoxyoligomer is present in an amount of about 1 to 25 weight percent, basedon the total weight of the silver chloride composition; the isobornylacrylate monomer present in an amount of about 2 to 16 weight percent,based on the total weight of the silver chloride composition; the silverpowder is present in an amount of about 20 to 60 weight percent, basedon the total weight of the silver chloride composition; the silverchloride powder is present in an amount of about 30 to 50 weightpercent, based on the total weight of the silver chloride composition;and the photoinitiator is present in an amount of about 1 to 15 weightpercent, based on the total weight of the silver chloride composition.19. The silver chloride composition of claim 18 further comprising analiphatic acrylated oligomer.
 20. The silver chloride composition ofclaim 19 wherein the aliphatic acrylated oligomer is present in anamount of about 0.1 to 15 weight percent, based on the total weight ofthe silver chloride composition.